Discover our selection of reballing stencils for mobile ICs, designed for precise BGA ball placement when reworking or replacing smartphone chips. These stencils help technicians restore IC function efficiently and accurately.

Available for power ICs, charging ICs, audio ICs, and UFS. Compatible with iPhone, Samsung, Xiaomi, OPPO, and more.

Home » Stencil (Roballing)
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Why Buy Reballing Stencils from Handasa-EG?

  • High-precision BGA templates for reballing various types of ICs.
  • Compatible with popular chipsets used in iPhone, Samsung, and other phones.
  • Made from durable stainless steel for long-term use.
  • Essential for accurate micro-soldering and IC replacement.
  • Fast delivery across Egypt and trusted customer support.